semiconductor-digest

ERS Introduces Automated 310mm Panel-Level Packaging System

ERS electronic today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates.

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates.
Yahoo Finance

Packaging Automation Solution Business Report 2026: Growing Influence of Industry 4.0 and Smart Factories Fuels Integration of Automated Packaging Solutions with IoT and Cloud ...

Dublin, March 04, 2026 (GLOBE NEWSWIRE) -- The "Packaging Automation Solution - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. The global market for ...
FreshPlaza

"Adaptation to automatic packaging machines is one of the main trends"

“Our largest challenge is to coordinate with growers in order to cut costs and improve working efficiencies in the packing houses. Our solutions help growers to extend the shelf-life of their products ...