BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
Another common mistake is simply reducing the diameter of the through-holes to permit space to reroute the breakout. To maintain manufacturability, I recommend a minimum 6mil finished hole size/8mil ...
Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...
Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
Memory chip packaging designs changed significantly when the industry moved from SDR to DDR. Some common DRAM packaging includes Thin Small-Outline Package (TSOP), Chip-Scale Packaging (CSP), ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
Editorial Note: Talk Android may contain affiliate links on some articles. If you make a purchase through these links, we will earn a commission at no extra cost to you. Learn more. Mobile phone ...
When you can buy something at a low price in one location, and sell it at a higher price somewhere else, you’re engaged in what economists call “arbitrage”. We’re not sure if desoldering DDR5 chips ...
Computer hardware gets better, faster, and cheaper as time goes by. This is particularly true of portable computing devices such as the Dell XPS notebook we are looking at today. What we are ...
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