Lam Research continues attracting attention as AI-driven semiconductor demand and advanced chip manufacturing activity ...
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TSMC is now racing to build 18 new chip fabs and packaging plants at once — a frantic bid to feed AI’s bottomless appetite for silicon
Somewhere in the Arizona desert, concrete is being poured for what will become one of the most advanced semiconductor ...
May 20 (Reuters) - Lam Research has opened a research lab in Salzburg, Austria, to advance a chip packaging technology that promises to increase chip density and cut costs, as the company looks to ...
Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...
By Toby Sterling ANTWERP, Belgium, May 20 (Reuters) - The booming global semiconductor market will be "tense" with tight ...
TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...
With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...
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Semiconductor equipment stocks powering the AI chip manufacturing boom: Etching
Quick Read Lam Research (LRCX) reported Q1 FY26 revenue of $5.84B with 50% gross margins and 35% operating margins, with next ...
The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...
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