Mechanical engineers have designed a more effective and energy-efficient technology for cooling computer chips. Publishing May 7 in the Cell Press journal Cell Reports Physical Science, the ...

Dense array of rough copper pillars on a copper plate. A new 3D-printed cold plate used for liquid-cooling high-power computer chips consists of an array of computationally designed, bumpy copper ...

A University of Illinois Urbana-Champaign team published research showing 3D-printed pure copper cooling plates could reduce data center cooling energy use from 30-40% of total power draw to just 1.1% ...

You knew it was coming. Liquid cooling is becoming mainstream and critical to addressing cloud-computing needs such as support for artificial intelligence (AI). This is needed not only for CPUs, GPUs, ...

As of 2025, single-phase direct-to-chip (D2C) cooling remains the dominant solution for high-end GPU thermal management. However, as thermal design power (TDP) continues to climb, two-phase D2C ...

The microfluidic cooling system tested by Microsoft promises up to 3x better heat removal than cold plates, improved power usage, and reduced operational costs. Microsoft has announced a new cooling ...

Use left and right arrow keys to seek audio. CoolIT has just announced its latest liquid cooling cold plate, destined for high-powered data centers, capable of dissipating an incredible 1.4kW of heat.