Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It provides a practical route to high-performance electronics beyond ...

This application note is intended to be used as a designer’s guide to component selection and usage. The data contained within this document is typical data taken at 25⁰C and 5.0 V Vcc, except when ...

International Truck and Engine Corp. has introduced its new Diamond Logic Application Solution, designed to simplify truck chassis and body equipment integration for body builders, up-fitters, and end ...