KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...

This fourth article in a six-part series examines the potential use of hardwood tree species as components of engineered wood ...