Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...
A recent review article published in Advanced Materials explored the potential of artificial intelligence (AI) and machine learning (ML) in transforming thermoelectric (TE) materials design. The ...
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