Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Package heat spreaders can offer a variety of benefits such as protection of the silicon, warpage management, increased reliability, and thermal enhancement, however, there are tradeoffs for every ...

Hungry individuals don't put much thought into the packaging of their food. When people grab a snack, they generally rip into ...

RIT’s packaging science program recently received an equipment donation for its Packaging Dynamics Laboratory that will increase its academic and professional training options in safe-guarding shipped ...

The 10-minute video shows how former NASA engineer created a booby-trap disguised as a delivered package that surprises porch thieves by setting off a “glitter bomb” and Fart Spray upon they open the ...

Following a successful Virtual Engineering Week event, which took place November 30 – December 4, 2020, Virtual Engineering Days is the second digital event offered ahead of the upcoming Informa ...