Until recently, signal integrity has been a concern relegated predominantly to multi-gigabit serial interface design. Today, it is an aspect of design that engineers building high-speed parallel ...

The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT), data demands around connected and self-driving ...

A submount platform supports thermal management, signal integrity, and alignment for optical and RF systems in high-speed ...

As every engineer learns at an early stage, clock edges must be obeyed. In the digital domain, synchronization through global and local clock trees, slew rate and rising/falling times all combine to ...

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most ...

For system-on-a-chip designs at 90 and 65 nm, dynamic noise greatly exacerbates the challenge of timing signoff. To accurately examine noise effects, designers need tools that provide an accurate ...

No gadget in this episode, I thought instead I’d write about a book I purchased recently. It is Eric Bogatin’s “Signal and Power Integrity — Simplified” second edition. Like most of you, I’ve got a ...

Samsung has developed a new chip packaging technology that could significantly improve the speed and power-efficiency of semiconductor chips. The new Interposer-Cube4 (I-Cube4) technology is the ...