The EP42HT-2LTE is a two-component, room-temperature curing epoxy that features an ultra-low coefficient for thermal expansion and highly reliable electrical insulator. It can be used as an adhesive, ...
This article discusses bonding of substrates with different coefficients of thermal expansion (CTE) which is difficult in adhesive applications such as bonding aluminum to glass, glass to plastics, ...
The following thermal expansion chart compares the "Coefficient of linear thermal expansion" shown as a factor m/m.k in the table. All materials expand with changes in Temperature. Thermoplastics ...
This paper analyzes the efficiency of silicon MOSFETs in surface-mount (SMD) packages with top-side cooling compared to bottom-side cooling packages in terms of thermal performance, lowering both ...
Engineering Precision Drives SiSiC Adoption The global heat exchanger and thermal management industry is undergoing a significant transformation. Driven by energy efficiency targets, environmental ...
Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...
Designers rarely consider how changes in temperature might affect linear-variable differential transformers (LVDTs). Yet a temperature change large enough can skew LVDT readings. This affect can take ...
In this interview, Venkat Nandivada Manager of Technical Sales at Master Bond Inc talks to AZoM about the tricky task of bonding two dissimilar substrates together. In your opinion, what is one of the ...
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