Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...
This chapter is devoted to a discussion of the various unit processes of soldering, e.g., fluxing, preheating, soldering, and cleaning. The equipment itself is covered in Chap. 6. The techniques of ...
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