This coupling heavily influences performance and yield. Heat induces mechanical deformation, deformation alters carrier ...

The impact of combining electrical and optical test in a single device.

How evolving standards, design-for-test strategies, and automation are shaping efficient production testing for 2.5D and 3D ...

Nevertheless, the economic incentive is growing. Interposers are becoming bigger, more essential, and more costly for many ...

AI changes everything: By 2030, Tseng noted that nearly half of the semiconductor industry’s capital expenditure will be ...

To identify and evaluate candidate materials, process engineers must analyze an enormous amount of data. Bulk properties like ...

Achieving the CD gratings for future technology nodes requires multi-patterning approaches, such as self-aligned ...

Multi-modal sensors generate data that edge AI can turn into actionable insights, provided new devices can be integrated with ...

One of the defining challenges of advanced packaging lies in maintaining traceability as dies move through multiple ...

Will a formal specification be part of the future, or will we continue to see natural language specifications? Will formal ...

An Integrated Agentic AI Safety System for Edge Artificial Intelligence” was published by researchers at Princeton University ...

Researchers from RIKEN created a self-healing polymer that can repair itself after being damaged by modifying polyolefins, a ...